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Kingston ME Ksm32ed8 32hc 32gb 3200mhz Ddr4 Ecc Cl22 Dimm 2rx8 Hynix C Retail
Kingston ME Ksm32ed8 32hc 32gb 3200mhz Ddr4 Ecc Cl22 Dimm 2rx8 Hynix C Retail
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$147.09 USD
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KSM32ED8/32HC
32GB 2Rx8 4G x 72-Bit PC4-3200
CL22 288-Pin DIMM
DESCRIPTION
Kingston's KSM32ED8/32HC is a 4G x 72-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM)¸ 2Rx8¸ ECC¸ memory module¸ based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data¸ strobe¸ and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
Temperature sensor with integrated SPD
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23? (31.25mm)
RoHS Compliant and Halogen-Free.
32GB 2Rx8 4G x 72-Bit PC4-3200
CL22 288-Pin DIMM
DESCRIPTION
Kingston's KSM32ED8/32HC is a 4G x 72-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM)¸ 2Rx8¸ ECC¸ memory module¸ based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data¸ strobe¸ and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
Temperature sensor with integrated SPD
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23? (31.25mm)
RoHS Compliant and Halogen-Free.
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