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Kingston ME KSM26ED8 32HC 32GB 2666MHz DDR4 ECC CL19 DIMM 2Rx8 Hynix C Retail
Kingston ME KSM26ED8 32HC 32GB 2666MHz DDR4 ECC CL19 DIMM 2Rx8 Hynix C Retail
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$122.79 USD
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$122.79 USD
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KSM26ED8/32HC
32GB 2Rx8 4G x 72-Bit PC4-2666
CL19 288-Pin DIMM
DESCRIPTION
Kingston's KSM26ED8/32HC is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM)¸ 2Rx8¸ ECC¸ memory module¸ based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data¸ strobe¸ and mask signals
Data transfer rates: PC4-2666¸ PC4-2400¸ PC4-2133¸ PC4-1866¸ PC4-1600
Low-power auto self-refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
Temperature sensor with integrated SPD
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23 (31.25mm)
RoHS Compliant and Halogen-Free
32GB 2Rx8 4G x 72-Bit PC4-2666
CL19 288-Pin DIMM
DESCRIPTION
Kingston's KSM26ED8/32HC is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM)¸ 2Rx8¸ ECC¸ memory module¸ based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data¸ strobe¸ and mask signals
Data transfer rates: PC4-2666¸ PC4-2400¸ PC4-2133¸ PC4-1866¸ PC4-1600
Low-power auto self-refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
Temperature sensor with integrated SPD
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23 (31.25mm)
RoHS Compliant and Halogen-Free
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